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somewhat similar technique was used by the metallurgists of old Damascus to produce sharpest polished swords in the medieval era. In the world of semiconductor processing, this technique was initially used to form vias that are used to connect interconnects at different levels of an IC. In damascene processing, the patterns of interconnects or vias are formed rst by etching the oxide on the substrate. Then the seed layer is deposited on the patterned substrate/oxide. This is followed by copper electroplating which deposits inside and outside the patterned features. Special care is taken to avoid the formation of voids and seams (shown in Fig. 1.2.3) during the late stages of copper deposition. The excess copper is nally removed by the chemical mechanical planarization process. The steps involved in making copper interconnects using the damascene process are shown in Fig. 1.2.4. This process is repeated several times to form interconnects and vias for a multilevel interconnect structure required on an IC chip. The process described above is called the single damascene process because it differs from the more widely used dual damascene process in which both the interconnects and the vias are rst patterned by etching of the substrate/oxide before the seed layer is formed and copper is deposited. It reduces the number of processing steps by avoiding one copper deposition step and one planarization step for each level of the interconnect structure. The steps involved in making copper interconnects using the dual damascene process are shown in Fig. 1.2.5.

You can create custom Quick Access toolbars to display the commands that you might frequently use and want to access, no matter which toolbars or ribbon panels are currently displayed. To create a new Quick Access toolbar, display the Customize User Interface Editor, right-click the Quick Access Toolbars item, and choose New Quick Access Toolbar. After you create a new Quick Access toolbar, you must assign it to the Quick Access Toolbars node of a workspace in order to display it in the application window. Follow these steps:

If the second digit is a 1, the priority of the log entry is low. If the second digit is a 2, the priority of the log entry is medium. If the second digit is a 3, the priority of the log entry is high.

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5 In the Layers palette, double-click each layer and then rename them (respectively) Lighthouse and Dune Grass. 6 Still in the Layers palette, click the Lighthouse layer to select it, then click the Eye icon to the left of the Dune Grass layer to hide it.

In XhTML documents, the break tag is coded as <br />. Dreamweaver inserts the correct tag based on the document type. n

Set the type to plain text using the character set ISO-8859-1.

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Adding the first equation one-half times (m2,1 = -i)

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The equivariant algorithms presented in this section have several interesting properties which can be formulated in the form of the following theorems (see S. Cruces et al. for more details) [321, 326, 327]. Theorem 8.1 The local convergence of the cumulant based equivariant algorithm (8.34) is isotropic, i.e., it does not depend on the source distribution, as long as their (1 + q)-order cumulants do not vanish.

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Example 1.2 (Noisy measurement of a binary signal)

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